GameCube technical specifications

{{short description|Overview of the technical specifications of the GameCube}}

{{Use mdy dates|date=November 2015}}

Nintendo originally offered a digital video output on early GameCube models. However, it was determined that less than one percent of users utilized the feature. The company eventually removed the option starting with model number DOL-101 of May 2004.{{cite web|access-date=March 27, 2008|url=https://www.nintendo.com/consumer/systems/nintendogamecube/component_faq.jsp|title=Nintendo's GameCube Component FAQ page|publisher=Nintendo}}

The console's technical specifications are as follows.{{cite web|url=http://www.segatech.com/gamecube/overview/|title=DCTP - Nintendo's Gamecube Technical Overview|access-date=November 22, 2015|archive-date=December 31, 2015|archive-url=https://web.archive.org/web/20151231164805/http://www.segatech.com/gamecube/overview/|url-status=dead}}{{cite web|url=https://www.angelfire.com/electronic2/mariotan/|title=Console Specs|access-date=November 22, 2015}}{{cite web|url=http://ign.com/articles/2000/11/04/gamecube-versus-playstation-2|title=Gamecube Versus PlayStation 2|author=IGN Staff|date=November 4, 2000|work=IGN|access-date=November 22, 2015}}

File:GEKKO.jpg

File:IBM Gekko Die Exposed.jpg

File:Ic-photo-ATI--D8926F2011--(Flipper A)--(Gamecube-GPU).jpg

File:Flipper GPU Exposed.jpg

File:Gamecube RAM Exposed.jpg

File:Gamecube-disk.jpg]]

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CPU

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  • 32-bit 486 MHz IBM "Gekko" PowerPC CPU (based on the 750CXe and 750FX){{citation needed|date=April 2016}}
  • 180 nm IBM six-layer, copper-wire process, 43{{nbsp}}mm2 die with 4.9 watts dissipation
  • 1.8 V for logic and I/O
  • 27×27 mm PBGA package with 256 contacts
  • 18.6 million transistors; of which 6.35 million transistors are for logic
  • Superscalar 3 issue (2 plus branch folding)
  • Out-of-order execution
  • Two 4-stage integer units: IU1 and IU2, 32-bit
  • Front-side bus:
  • 162 MHz 64-bit enhanced 60x bus northbridge to Flipper
  • 1.3 GB/s peak bandwidth (32-bit address, 64-bit data bus)
  • On-chip caches:
  • 32{{nbsp}}KB 8-way set-associative L1 instruction cache
  • 32{{nbsp}}KB 8-way set-associative L1 data cache
  • Half of L1 data cache (16{{nbsp}}KB) can be locked for fast DMA-from-cache in parallel with instruction execution
  • 256{{nbsp}}KB 2-way set-associative L2 cache
  • 64-bit Floating Point Unit (FPU) coprocessor:
  • PowerPC 750 + roughly 50 new SIMD instructions, geared toward 3D graphics
  • 7-stage pipeline
  • 32x 64-bit FPR registers
  • Usable as 1x 64-bit (double-precision) or 2× 32-bit (paired singles) SIMD per clock cycle.
  • 1.9 GFLOPS (single precision 32-bit floating point)
  • IEEE compliant
  • Data Compression
  • 2:1 and 4:1 compression for graphics data yields 5.2 GB/s peak effective bus bandwidth
  • Load Q instruction: converts 8-bit or 16-bit, signed or unsigned integers to SP floating point
  • Store Q instruction: converts SP floating point to 8-bit or 16-bit, signed or unsigned integer
  • Branch Prediction Unit (BPU)
  • Load-Store Unit (LSU)
  • System Register Unit (SRU)
  • Memory Management Unit (MMU)
  • Branch Target Instruction Cache (BTIC)
  • CPU performance: 1125 DMIPS (Dhrystone 2.1)

| style="text-align:center" | {{cite web|url=http://www.anandtech.com/show/858|title=Hardware Behind the Consoles - Part II: Nintendo's GameCube|last=Shimpi|first=Anand Lal|date=December 7, 2001|publisher=AnandTech|access-date=July 9, 2013}}{{cite web|access-date=March 27, 2008|url=http://www.aceshardware.com/read.jsp?id=60000288|archive-url=https://web.archive.org/web/20040208044032/http://www.aceshardware.com/read.jsp?id=60000288|archive-date=February 8, 2004|title=Game Consoles: A Look Ahead|date=December 14, 2003|publisher=Ace's Hardware}}

GPU

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  • 162 MHz ArtX-designed ATI "Flipper" ASIC (9.4 GFLOPS)
  • 180 nm NEC eDRAM manufacturing process, 51 million transistors (approximately half dedicated to 1T-SRAM), 106 mm2 die
  • Contains GPU, audio DSP, I/O controller and northbridge
  • MB of on-chip 1T-SRAM (2 MB Z-buffer/framebuffer + 1 MB texture cache) with ~18 GB/s total bandwidth
  • Embedded 24-bit Z-buffer/framebuffer RAM: 2 MB (4× 512 KB)
  • Bus width: 384-bit (4 buses, each 96-bit wide)
  • Bandwidth: 7.8 GB/s
  • Sustainable latency: Under 5 ns
  • Embedded texture cache: 1 MB (32× 256 Kb)
  • Bus width: 512-bit (32 buses, each 16-bit wide)
  • Bandwidth: 10.4 GB/s
  • Sustainable latency: Under 5 ns
  • 24 MB (2× 12 MB) 1T-SRAM main memory @ 324 MHz, 64-bit bus, 2.6 GB/s bandwidth
  • 1 vertex pipeline, 4 pixel pipelines with 1 texture mapping unit (TMU) each and 4 render output units (ROPs)
  • Simultaneous textures per pass: 4
  • Color depth: 24-bit RGB, 32-bit RGBA
  • System floating-point arithmetic capability: 11 GFLOPS (peak) (MPU, Geometry Engine, Hardware Lighting Total)
  • Fillrate: 648 megapixels/sec, with Z-buffering, alpha blending, fogging, texture mapping, trilinear filtering, mipmapping and S3 Texture Compression[https://www.ign.com/articles/2001/03/17/graphics-processor-specifications Graphics Processor Specifications], IGN, 2001
  • Raw polygon performance: 60 million polygons/sec{{cite web|url=http://ign.com/articles/2001/01/17/gamecube-101-graphics|title=GameCube 101: Graphics|author=IGN Staff|date=January 17, 2001|work=IGN|access-date=November 22, 2015}}
  • 40 million polygons/sec, with fogging, Z-buffering, alpha blending and Gouraud shading
  • 30 million polygons/sec, with fogging, Z-buffering, alpha blending and texture mapping
  • 25 million polygons/sec, with fogging, Z-buffering, alpha blending, texture mapping and lighting
  • 6-12 million polygons/sec,{{cite web|url=https://www.ign.com/articles/2001/01/09/x-ing-things-out|website=IGN|archive-url=https://web.archive.org/web/20010123223800/http://cube.ign.com/news/29756.html|title=X-ing Things Out|date=January 9, 2001 |archive-date=January 23, 2001|access-date=November 12, 2021|df=mdy-all}} assuming actual game conditions, with complex models, fully textured, fully lit, etc.
  • 16-stage TEV fixed-function texture combiner unit (4 inputs, 1 output)[http://amnoid.de/gc/tev.html]
  • Image processing functions: Volumetric fog, heat haze, motion blur, bloom, subpixel anti-aliasing, per-vertex lighting, 8 hardware lights, alpha blending, hardware transform and lighting (T&L), virtual texture design, multi-texturing, emboss bump mapping, Dot3 bump mapping (normal mapping), lightmapping, shadow mapping, shadow volumes, planar projection shadows, environment mapping, mipmapping, LOD, depth of field, perspective-correct texture mapping, bilinear filtering, trilinear filtering, anisotropic filtering, real-time hardware texture decompression (S3TC) (6:1 ratio), 8 simultaneous texture layers, 256 levels of transparency, clipping, hidden surface removal/culling, Zfreeze, Zcomploc/early-Z reject, bounding box, destination alpha test, alpha test, depth test, render to texture, TEV compare, color combiners, alpha combiners, texture combiners, transparency effects, framebuffer effects, post-processing effects, Gouraud shading, cel shading, dithering, can emulate 1-bit stencil buffer through a Zfreeze function
  • Other: Real-time decompression of display list, hardware motion compensation capability, HW 3-line deflickering filter

| style="text-align:center" | [http://www.eetimes.com/document.asp?doc_id=1227977 GameCube clears path for game developers], EE Times, 5/16/2001

System memory

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  • 43 MB total non-unified RAM
  • 24 MB (2× 12 MB) MoSys 1T-SRAM @ 324 MHz (codenamed "Splash") as main system RAM
  • 3 MB embedded 1T-SRAM cache within "Flipper" GPU (2 MB framebuffer/Z-buffer, 1 MB texture cache)
  • 16 MB DRAM used as I/O buffer for audio and DVD drive
  • Memory bus width: 64-bit main system RAM, 896-bit internal GPU memory, 8-bit ARAM
  • Memory bandwidth: 1.3 GB/s Gekko to Northbridge, 2.6 GB/s Flipper to main system RAM, 10.4 GB/s texture cache, 7.8 GB/s framebuffer/Z-buffer, 81 MB/s auxiliary RAM
  • Latency: Under 10 ns main memory, 5 ns texture cache, 5 ns framebuffer memory

| style="text-align:center" | {{cite web |access-date=March 28, 2008 |url=http://register.nintendo.com/techspecgcn |archive-url=https://web.archive.org/web/20080502201300/http://register.nintendo.com/techspecgcn |archive-date=May 2, 2008|title=GCN Technical Specifications |publisher=Nintendo}}

Audio

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  • Audio processor integrated into Flipper: custom 81 MHz Macronix 16-bit DSP
  • Sampling frequency: 48 kHz
  • 64 simultaneous channels, ADPCM encoding
  • Instruction memory: 8 KB RAM, 8 KB ROM
  • Data memory: 8 KB RAM, 4 KB ROM
  • External auxiliary RAM: 16 MB DRAM @ 81 MHz
  • Auxiliary RAM bus: 8-bit
  • Auxiliary RAM bus bandwidth: 81 MB/s
  • CPU can read/write blocks from RAM to ARAM through DMA; ARAM can be used for miscellaneous low-bandwidth purposes[https://blog.lse.epita.fr/articles/38-emulating-the-gamecube-audio-processing-in-dolphin.html]
  • Stereo output (may contain 5.1-channel surround via Dolby Pro Logic II)

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Video modes

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  • 640×480 interlaced (480i) @ 60 Hz
  • 640×480 progressive scan (480p) @ 60 Hz {{Failed verification span|(mostly NTSC games only)|date=November 2023}}
  • {{Failed verification span|640×576 interlaced (576i) @ 50 Hz (PAL games only)|date=November 2023}}

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Connectivity

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| style="text-align:center" | {{BSN|date=August 2020}}

Storage

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  • 8 cm optical GameCube Game Disc
  • Approx. 1.5 GB capacity
  • 16 Mbit/s–25 Mbit/s transfer rate operating in CAV mode
  • 128 ms average access time
  • Memory card
  • Capacities: 512 KB (59 blocks), 2 MB (251 blocks), 8 MB (1,019 blocks, incompatible with some games{{Cite web|url=https://www.nintendo.com/consumer/memorycard1019.jsp|title = | Nintendo - Customer Service - Memory Card 1019 |}})
  • 8 KB sectors

| style="text-align:center" | {{cite web |url=https://www.nintendo.co.uk/NOE/en_GB/systems/accessories_1222.html |title=Nintendo GameCube Accessories |publisher=Nintendo |access-date=July 3, 2009 |url-status=dead |archive-url=https://archive.today/20120911060746/http://www.nintendo.co.uk/NOE/en_GB/systems/accessories_1222.html |archive-date=September 11, 2012 |df=mdy-all }} (dead)

Other

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  • Power supply
  • DC 12 volts
  • 3.25 A
  • Dimensions: {{cvt|4.3|in}} (H) × {{cvt|5.9|in}} (W) × {{cvt|6.3|in}} (D)

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References

{{reflist|2}}

{{GameCube}}

{{Nintendo hardware}}

{{AMD graphics}}

Category:GameCube

Category:PowerPC-based video game consoles

Category:Video game hardware