IEEE Transactions on Advanced Packaging

{{Infobox journal

| title = IEEE Transactions on Advanced Packaging

| editor = Ganesh Subbarayan

| discipline = Multi-chip modules, wafer-scale integration

| formernames = IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing

| abbreviation = IEEE Trans. Adv. Packag.

| publisher = IEEE Components, Packaging, and Manufacturing Technology Society

| country =

| frequency = Quarterly

| history = 1999{{ndash}}2010

| openaccess =

| license =

| impact = 1.276

| impact-year = 2010

| website = http://ieeexplore.ieee.org/xpl/aboutJournal.jsp?punumber=6040

| JSTOR =

| OCLC = 39742480

| LCCN = 99111625

| CODEN = ITAPFZ

| ISSN = 1521-3323

| eISSN =

}}

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.{{cite book |year=2011 |chapter=IEEE Transactions on Advanced Packaging |title=2010 Journal Citation Reports |publisher=Thomson Reuters |edition=Science |series=Web of Science|title-link=Journal Citation Reports }}