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Solder alloys#Sn63Pb37

{{Short description|Metallic material}}

File:Propane torch soldering copper pipe.jpg and a lead-free solder]]

Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ones are listed below. Since early 2000s the use of lead in solder alloys is discouraged by several governmental guidelines in the European Union, Japan and other countries, such as Restriction of Hazardous Substances Directive and Waste Electrical and Electronic Equipment Directive.

Solder alloys

class="wikitable sortable"

! rowspan=2 | Composition

! colspan=2 | Melting point (°C)

! rowspan=2 | Non-toxic

! rowspan=2 | Eutectic

! rowspan=2 | Comments

Solidus

! Liquidus

{{chem2|Bi100}}

| colspan=2 | 271

{{yes}}{{n/a|Pure}}Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.
{{chem2|In66.7Bi33.3}}

| colspan=2 | 72.7

{{chem2|In61.7Bi30.8Cd7.5}}

| colspan=2 | 62{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=4ccb81db2b7e4eb5a517409445b37deb|title=Indium Corp. Indalloy 18 Indium Solder Alloy|accessdate=20 July 2016}}

{{no|Cd}}{{yes}}
{{chem2|Bi56Sn30In14}}

| 79

91{{yes}}ChipQuik desoldering alloy, lead-free{{cite web|url=http://www.chipquik.com/store/product_info.php?products_id=220001|title=Chip Quik – SMD Removal Kit (Chip Quik Alloy 2.5ft, flux, alcohol pads) lead-free|accessdate=20 July 2016}}
{{chem2|In51.0Bi32.5Sn16.5}}

| colspan=2 | 60.5

{{yes}}{{yes}}Field's metal
{{chem2|Bi50.0Pb25.0Sn12.5Cd12.5}}

| colspan=2 | 71

{{no|Cd, Pb}}{{partial|Near}}Wood's metal, mostly used for casting.
{{chem2|Bi50Pb26.7Sn13.3Cd10}}

| colspan=2 | 70

{{no|Cd, Pb}}{{yes}}Cerrobend. Used in low-temperature physics as a solder.
{{chem2|Bi49.5Pb27.3Sn13.1Cd10.1}}

| colspan=2 | 70.9

{{no|Cd, Pb}}{{partial|Near}}Lipowitz Metal
{{chem2|Bi50.5Pb27.8Sn12.4Cd9.3}}

| 70

73{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=82d47484509e4e81b53f487bed41a324|title=Indium Corp. Indalloy 22 Bismuth Solder Alloy|accessdate=20 July 2016}}{{no|Cd, Pb}}{{no}}
{{chem2|Bi44.7Pb22.6In19.1Cd5.3Sn8.3}}

| colspan=2 | 47

{{no|Cd, Pb}}{{yes}}Cerrolow 117. Used as a solder in low-temperature physics.
{{chem2|Bi49Pb18Sn12In21}}

| colspan=2 | 58

{{no|Pb}}{{yes}}Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics. Also the ChipQuik desoldering alloy.Johnson Manufacturing Co, [http://www.chipquik.com/msds/SMD1.pdf MSDS for Chip Quik Alloy w/Lead]. Retrieved on February 6, 2015.
{{chem2|Bi49Pb18Sn15In18}}

| 58

69{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=5a48bcea477c4b2eb9153f5fc28243da|title=Indium Corp. Indalloy 21 Bismuth Solder Alloy|accessdate=20 July 2016}}{{no|Pb}}{{no}}
{{chem2|Bi48Pb25.4Sn12.8Cd9.6In4}}

| 61

65{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=bf336aff588c4e72acb714d5a4ae13c6|title=Indium Corp. Indalloy 147 Bismuth Solder Alloy|accessdate=20 July 2016}}{{no|Cd, Pb}}{{no}}
{{chem2|Bi47.5Pb25.4Sn12.6Cd9.5In5}}

| 57

65{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=61beeec304154e14b711984757f073ed|title=Indium Corp. Indalloy 140 Bismuth Solder Alloy|accessdate=20 July 2016}}{{no|Cd, Pb}}{{no}}
{{chem2|Bi58Pb42}}

| 124

126{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=4c19e3682c3b4d3198f3025b81cce73f|title=Indium Corp. Indalloy 67 Bismuth-Lead Solder Alloy|accessdate=20 July 2016}}{{no|Pb}}
{{chem2|Bi57Sn43}}

| colspan=2 | 139

{{yes}}{{yes}}Bi57. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. Low-temperature eutectic solder with high strength. Particularly strong, very brittle. Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.{{cite book|url=https://books.google.com/books?id=H75TywRXUK4C&pg=PA21|title=Handbook of lead-free solder technology for microelectronic assemblies|author1=Karl J. Puttlitz |author2=Kathleen A. Stalter |publisher=CRC Press|year=2004 |isbn=978-0-8247-4870-8}} Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=967a4cd7871b46fa9128a29c303cf8be|title=Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy|accessdate=20 July 2016}} Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification. https://himikatus.ru/art/phase-diagr1/Bi-Sn.php confirms eutectic at 139 C
{{chem2|Bi52Pb32Sn16}}

| colspan=2 | 96

{{no|Pb}}yes?Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.{{cite book|url=https://books.google.com/books?id=vMpHHWboSAAC&pg=PA178|title=Solder joint reliability: theory and applications|publisher=Springer|page=178|author=John H. Lau|isbn=978-0-442-00260-2|year=1991}}
{{chem2|Bi50.0Pb31.2Sn18.8}}

| colspan=2 | 97

{{no|Pb}}{{no}}Newton's metal
{{chem2|Bi50Pb28Sn22}}

| colspan=2 | 109

{{no|Pb}}{{no}}Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling.
{{chem2|Bi46Sn34Pb20}}

| 100

105{{no|Pb}}{{no}}Bi46
{{chem2|Sn48Bi32Pb20}}

| 140

160{{no|Pb}}{{no}}For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting.
{{chem2|Sn43Pb43Bi14}}

| 144

163{{no|Pb}}{{no}}Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. Useful for step soldering.
{{chem2|Sn46Pb46Bi8}}

| 120

167{{no|Pb}}{{no}}Bi8
{{chem2|Sn89Zn8Bi3}}

| 191

198{{yes}}Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this.
{{chem2|Sn86.5Zn5.5In4.5Bi3.5}}

| 174

186{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=67e162f8c187441a85e22ea1b98b52a0|title=Indium Corp. Indalloy® 231 Sn-Zn-In-Bi Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}Lead-free. Corrosion concerns and high drossing due to zinc content.
{{chem2|Bi57Sn42Ag1}}

| 137
139

139
140{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=3f9d5aa624ea454f81308048ab101817|title=Indium Corp. Indalloy® 282 57Bi/42Sn/1Ag Lead-Free Solder Alloy|accessdate=20 July 2016}}		{{yes}}Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola.
{{chem2|Sn91.8Bi4.8Ag3.4}}

| 211

213{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=fbf7a599eb0e407981ed2f785bbe24ee|title=Indium Corp. Indalloy® 249 91.8Sn/3.4Ag/4.8Bi Lead-Free Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}Do not use on lead-containing metallizations.Paul T. Vianco and Jerome A. Rejent (1994) "Tin-silver-bismuth solders for electronics assembly " {{US Patent|5439639}}
{{chem2|Sn88In8.0Ag3.5Bi0.5}}

| 197

208{{yes}}Patented by Matsushita/Panasonic. {{Citation needed|reason=Claimed without appropriate source since February 2006.|date=January 2023}}
{{chem2|Sn99.3Cu0.7Ni?Bi?}}

| colspan=2 | 227[https://www.kester.com/DesktopModules/Bring2mind/DMX/Download.aspx?Command=Core_Download&EntryId=1252&language=en-US&PortalId=0&TabId=96 K100LD]. kester.com

{{yes}}K100LD, a lead-free silver-free nickel-stabilized alloy, with low dissolving (LD) of copper. Proprietary to Kester. Similar to Sn99Cu1. The nickel content lowers copper erosion and promotes shiny solder fillet. Bismuth acts in synergy with nickel to further reduce copper dissolution and reduces surface tension. Performance similar to SAC alloys at lower cost. K100LDa has 0.2% copper, used to refill wave soldering pots to counteract copper buildup. Lower than optimal nickel content to avoid patents?[https://floridacirtech.com/wp-content/uploads/2018/10/SN100C-Technical-Guide.pdf SN100C® Technical Guide]. floridacirtech.com
{{chem2|In74Cd26}}

| colspan=2 | 123{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=1fef3a2158ba400abe6f7e2a5c171ca1|title=Indium Corp. Indalloy 253 Indium Solder Alloy|accessdate=20 July 2016}}

{{no|Cd}}{{yes}}
{{chem2|Pb92Cd8}}

| colspan=2 | 310?

{{no|Cd, Pb}}?For soldering aluminium.George P Luckey (1920) {{US patent|1333666}}[http://www.csudh.edu/oliver/chemdata/alloys.htm Composition And Physical Properties Of Alloys] {{webarchive|url=https://web.archive.org/web/20120426211236/https://www.csudh.edu/oliver/chemdata/alloys.htm |date=2012-04-26 }}. Csudh.edu (2007-08-18). Retrieved 2010-07-06.
{{chem2|Cd70Sn30}}

| 140

160{{no|Cd}}{{no}}Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.
{{chem2|Sn40Pb42Cd18}}

| colspan=2 | 145

{{no|Cd, Pb}}Low melting temperature allows repairing pewter and zinc objects, including die-cast toys.
{{chem2|Sn50Pb32Cd18}}

| colspan=2 | 145

{{no|Cd, Pb}}Cd18
{{chem2|Cd82.5Zn17.5}}

| colspan=2 | 265{{cite web|title=Kapp Cad/Zinc|url=http://www.kappalloy.com/cad-zinc-solder.php|publisher=Kapp Alloy & Wire, Inc|accessdate=23 October 2012|archive-date=23 April 2012|archive-url=https://web.archive.org/web/20120423070826/http://www.kappalloy.com/cad-zinc-solder.php|url-status=dead}}

{{no|Cd}}{{yes}}Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Also for soldering aluminium and die-cast zinc alloys. Used in cryogenic physics for attaching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.{{cite book |last1=White |first1=Guy Kendall |url=https://books.google.com/books?id=xO0xMe7JvOsC&pg=PA207 |title=Experimental techniques in low-temperature physics |last2=Meeson |first2=Philip J. |publisher=Clarendon |year=2002 |isbn=978-0-19-851428-2 |pages=207– |author-link=Guy White |accessdate=14 May 2011}}
{{chem2|Cd70Zn30}}

| 265

300{{no|Cd}}{{no}}Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on aluminium-to-aluminium and aluminium-to-copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.
{{chem2|Cd60Zn40}}

| 265

316{{no|Cd}}{{no}}Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on aluminium-to-aluminium and aluminium-to-copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.
{{chem2|Zn60Cd40}}

| 265

335{{no|Cd}}For soldering aluminium. Very good wetting.
{{chem2|Zn90Cd10}}

| 265

399{{no|Cd}}For soldering aluminium. Good wetting.
{{chem2|Sn40Zn27Cd33}}

| 176

260{{cite web|title=KappRad|url=http://www.kappalloy.com/kapprad-solder.php|publisher=Kapp Alloy & Wire, Inc|accessdate=25 October 2012|archive-date=1 August 2013|archive-url=https://web.archive.org/web/20130801014419/http://www.kappalloy.com/kapprad-solder.php|url-status=dead}}{{no|Cd}}{{no}}KappRad Developed specifically to join and repair aluminium and aluminium/copper radiators and heat exchangers. A lower melting point makes delicate repair work easier.
{{chem2|Cd95Ag5}}

| 338

393{{cite web|title=KappTec|url=http://www.kappalloy.com/tec-solder.php|publisher=Kapp Alloy & Wire, Inc.|accessdate=23 October 2012|archive-date=31 July 2013|archive-url=https://web.archive.org/web/20130731234842/http://www.kappalloy.com/tec-solder.php|url-status=dead}}{{no|Cd}}{{no}}KappTec General purpose solder that will join all solderable metals except aluminium. High temperature, high strength solder. It is used in applications where alloys melting higher than soft solders are required, but the cost and strength of silver-brazing alloys is not necessary.
{{chem2|Cd78Zn17Ag5}}

| 249

316{{cite web|title=KappTecZ|url=http://www.kappalloy.com/tecz-solder.php|publisher=Kapp Alloy & Wire, Inc.|accessdate=25 October 2012|archive-date=23 April 2012|archive-url=https://web.archive.org/web/20120423045024/http://www.kappalloy.com/tecz-solder.php|url-status=dead}}{{no|Cd}}{{no}}KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on aluminium, copper and stainless steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600 °F, this solder is extremely fluid and will penetrate the closest joints.
{{chem2|Sn51.2Pb30.6Cd18.2}}

| colspan=2 | 145{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=199da4a304e44104868eaf537a7c9a16|title=Indium Corp. Indalloy® 181 Sn-Pb-Cd Solder Alloy|accessdate=20 July 2016}}

{{no|Cd, Pb}}{{yes}}General-purpose. Maintains creep strength well. Unsuitable for gold.
{{chem2|In70Sn15Pb9.6Cd5.4}}

| colspan=2 | 125{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=802ee7cd28ef4fd59cdc87d7e1fef98b|title=Indium Corp. Indalloy 13 Indium Solder Alloy|accessdate=20 July 2016}}

{{no|Cd, Pb}}
{{chem2|In100|link=Indium}}

| colspan=2 | 157

{{yes}}{{n/a|Pure}}In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures.{{cite journal|url=https://books.google.com/books?id=71tVjt0QUrEC&pg=PT27|journal=Advanced Packaging |date=May–Jun 2008|volume= 17|issue=4|issn=1065-0555 |page=24|title=Choosing the best bumb for the buck|author=T.Q. Collier}} Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron.
{{chem2|In75Pb25}}

| 156

165{{no|Pb}}{{no}}Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.
{{chem2|In70Pb30}}

| 160
165

174
175{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=afcc8e122d334379a6d0d7d7079fc54d|title=Indium Corp. Indalloy® 204 In-Pb Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties.
{{chem2|In60Pb40}}

| 174
173

185
181		{{no|Pb}}{{no}}In60. Low gold-leaching. Good thermal fatigue properties.
{{chem2|In50Pb50}}

| 180
178

209
210		{{no|Pb}}{{no}}In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure. On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. Less gold dissolution and more ductile than lead-tin alloys. Good thermal fatigue properties.
{{chem2|Pb60In40}}

| 195

225{{no|Pb}}{{no}}In40. Low gold-leaching. Good thermal fatigue properties.
{{chem2|Pb70In30}}

| 245

260{{no|Pb}}{{no}}In30
{{chem2|Pb75In25}}

| 250
240

264
260{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=3cc5ca3fdb7848bda630047dd05bb6b3|title=Indium Corp. Indalloy® 10 Pb-In Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.{{cite book|url=https://books.google.com/books?id=c2YxCCaM9RIC&pg=PA758|title=Electronic Materials Handbook: Packaging |page=758|author=Merrill L. Minges|publisher=ASM International|year=1989|isbn=978-0-87170-285-2}} Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.{{cite book|url=https://books.google.com/books?id=IcxDPA2U6esC&pg=PA385|title=Surface mount technology: principles and practice|page=385|author=Ray P. Prasad|publisher=Springer|year=1997|isbn=978-0-412-12921-6}}
{{chem2|Pb81In19}}

| 270
260

280
275{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=d7525946b1a446afa73b5dd52997a283|title=Indium Corp. Indalloy® 150 Pb-In Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}In19. Low gold-leaching. Good thermal fatigue properties.
{{chem2|In60Sn40}}

| 113

122{{yes}}{{no}}
{{chem2|In52Sn48}}

| colspan=2 | 118

{{yes}}{{yes}}In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing. Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials.
{{chem2|In50Sn50}}

| 118

125{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=718dfcb678cc42359978349a905862bc|title=Indium Corp. Indalloy 1 Indium-Tin Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder.
{{chem2|Sn52In48}}

| 118

131{{yes}}{{no}}very low tensile strength
{{chem2|Sn58In42}}

| 118

145{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=aea1c42aa0a341aa948d7103c3a4564b|title=Indium Corp. Indalloy 87 Indium-Tin Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}
{{chem2|Sn37.5Pb37.5In26}}

| 134

181{{no|Pb}}{{no}}In26
{{chem2|Sn37.5Pb37.5In25}}

| 134

181{{no|Pb}}{{no}}Good wettability. Not recommended for gold.
{{chem2|Sn54Pb26In20}}

| 130
140

154
152{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=fcd842de41fd4fcba9250418612914bf|title=Indium Corp. Indalloy 532 Tin Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}In20
rowspan=2 | {{chem2|Sn70Pb18In12}}

| colspan=2 | 162

| rowspan=2 {{no|Pb}}

| rowspan=2 {{yes}}

| rowspan=2 | General purpose. Good physical properties.

154167{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=5edfeb10d3c74d44967d0d605328c1e8|title=Indium Corp. Indalloy® 9 Sn-Pb-In Solder Alloy|accessdate=20 July 2016}}
{{chem2|In80Pb15Ag5}}

| 142
149

149
154{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=03e0734456b74c088b9f9c19f6af6ab9|title=Indium Corp. Indalloy® 2 In-Pb-Ag Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering.
{{chem2|Pb92.5In5Ag2.5}}

| 300

310{{no|Pb}}{{no}}UNS L51510. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used..
{{chem2|Pb90In5Ag5}}

| 290

310{{no|Pb}}{{no}}
{{chem2|Pb92.5In5Au2.5}}

| 300

310{{no|Pb}}{{no}}In5
{{chem2|Sn83.6Zn7.6In8.8}}

| 181

187{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=64d8ba345b524cdc815a1df1dc7142b0|title=Indium Corp. Indalloy 226 Tin Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}High dross due to zinc.Laurence G. Stevens and Charles E. T. White (1992) "Lead-free alloy containing tin, zinc and indium" {{US Patent|5242658}}
{{chem2|Sn77.2In20Ag2.8}}

| 175

187{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=e2f902d610494ab7a7f500fcfbdb43cc|title=Indium Corp. Indalloy® 227 Sn-In-Ag Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}Similar mechanical properties with {{chem2|Sn63Pb37}}, {{chem2|Sn62Pb36Ag2}} and {{chem2|Sn60Pb40}}, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C.
{{chem2|Sn86.9In10Ag3.1}}

| 204

205{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=778b662660244af7b8d9689a007e8813|title=Indium Corp. Indalloy® 254 86.9Sn/10.0In/3.1Ag Lead-Free Solder Alloy|accessdate=20 July 2016}}{{yes}}Potential use in flip-chip assembly, no issues with tin-indium eutectic phase.
{{chem2|In97Ag3}}

| colspan=2 | 143{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=a8d11bdcc82c4410af96f5d43579d420|title=Indium Corp. Indalloy® 290 In-Ag Solder Alloy|accessdate=20 July 2016}}

{{yes}}{{yes}}Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices.
{{chem2|In90Ag10}}

| 143

237{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=08d1a1dea82b4e13ac90e38eecb0b919|title=Indium Corp. Indalloy® 3 In-Ag Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics.
{{chem2|Au82In18}}

| 451

485{{yes}}{{no}}Au82. High-temperature, extremely hard, very stiff.
{{chem2|Pb90Sn10}}

| 268
275

302{{cite book|url=https://books.google.com/books?id=CQGPGwFuPRkC&pg=SA5-PA8 |title=Electronic materials and processes |pages=5–8|author=Charles A. Harper|publisher=McGraw-Hill Professional|year=2003|isbn=978-0-07-140214-9}}
302{{cite web |author= |date= |title=Solder Alloys |url=https://invacu.com/solder-alloys |archive-url=https://web.archive.org/web/20220329011817/https://invacu.com/solder-alloys |archive-date=March 29, 2022 |access-date=April 22, 2022 |website=invacu }}		{{no|Pb}}{{no}}Sn10, UNS L54520, ASTM10B. Balls for CBGA components, replaced by {{chem2|Sn95.5Ag3.9Cu0.6}}. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.[http://www.hirschmetals.com/pdfs/SolderAlloyChart.pdf SOLDER ALLOYS Selection Chart]. (PDF). Retrieved 2010-07-06. Has low thermal EMF, can be used as an alternative to {{chem2|Cd70}} where parasitic thermocouple voltage has to be avoided.{{cite book|chapter-url=http://www.analog.com/library/analogDialogue/archives/39-05/Web_Ch4_final.pdf|chapter=Ch. 4. Sensor Signal Conditioning|title=Op Amp Applications Handbook|author=Walt Kester James Bryant Walt Jung Scott Wurcer Chuck Kitchin|year=2005|publisher=Newnes/Elsevier|isbn=0-7506-7844-5|page=4.49|access-date=2019-03-10|archive-date=2013-11-26|archive-url=https://web.archive.org/web/20131126083440/http://www.analog.com/library/analogdialogue/archives/39-05/web_ch4_final.pdf|url-status=dead}}
{{chem2|Pb88Sn12}}

| 254

296{{no|Pb}}{{no}}Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.
{{chem2|Pb85Sn15}}

| 227

288{{no|Pb}}{{no}}Used for coating tubes and sheets and fabrication of car radiators. Body solder.
{{chem2|Pb80Sn20}}

| 183

280{{no|Pb}}{{no}}Sn20, UNS L54711. Used for coating radiator tubes for joining fins.
{{chem2|Pb75Sn25}}

| 183

266{{no|Pb}}{{no}}Crude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.
{{chem2|Pb70Sn30}}

| 185
183

255
257		{{no|Pb}}{{no}}Sn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.
{{chem2|Pb68Sn32}}

| colspan=2 | 253

{{no|Pb}}{{no}}"Plumber solder", for construction plumbing works{{cite book|url=https://books.google.com/books?id=1ZOXXV9LdcwC&pg=PA378|title=Manufacturing Processes |publisher=PHI Learning Pvt. Ltd.|page=378|author=Kaushish|isbn=978-81-203-3352-9|year=2008}}
{{chem2|Pb67Sn33}}

| 187

230{{no|Pb}}{{no}}PM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additives
{{chem2|Pb65Sn35}}

| 183

250{{no|Pb}}{{no}}Sn35. Used as a cheaper alternative of {{chem2|Pb60Sn40}} for wiping and sweating joints.
{{chem2|Pb60Sn40}}

| 183

238
247		{{no|Pb}}{{no}}Sn40, UNS L54915. For soldering of brass and car radiators. For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems.
{{chem2|Pb55Sn45}}

| 183

227{{no|Pb}}{{no}}For soldering radiator cores, roof seams, and for decorative joints.
{{chem2|Sn50Pb50}}

| 183

216
212		{{no|Pb}}{{no}}Sn50, UNS L55030. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below ?150 °C. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. For wiping and assembling plumbing joints for non-potable water.
{{chem2|Sn60Pb40}}

| 183

190
188		{{no|Pb}}{{partial|Near}}Sn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Slightly cheaper than {{chem2|Sn63Pb37}}, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than {{chem2|Sn63Pb37}}.[http://www.farnell.com/datasheets/315929.pdf Properties of Solders]. farnell.com.
{{chem2|Sn62Pb38}}

| colspan=2 | 183

{{no|Pb}}{{partial|Near}}"Tinman's solder", used for tinplate fabrication work.
{{anchor|Sn63Pb37}}{{chem2|Sn63Pb37}}

| colspan=2 | 183{{cite web|url=http://www.balverzinn.com/solder-Sn63Pb37.html?file=tl_files/balverzinn/downloads/datenblaetter_en/Solder%20Sn63Pb37.pdf|title=Balve Zinn Solder Sn63Pb37 – Balver Zinn|accessdate=20 July 2016}}

{{no|Pb}}{{yes}}Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of the most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. {{chem2|Sn60Pb40}} is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than {{chem2|Sn60Pb40}}.
{{chem2|Sn70Pb30}}

| 183

193{{no|Pb}}{{no}}Sn70
{{chem2|Sn75Pb25}}

|183

|238{{Cite web |date=January 1, 2017 |title=Safety Data Sheet |url=https://resource.bakerdist.com/is/content/Watscocom/Gemaire/amerway_sn50pb50_article_1456219847370_en_ss.pdf |access-date=April 19, 2022 |website=bakerdist.com}}

|{{no|Pb}}

|{{No|No}}

{{chem2|Sn90Pb10}}

| 183

213{{no|Pb}}{{no}}formerly used for joints in food industry
{{chem2|Sn95Pb5}}

| colspan=2 | 238

{{no|Pb}}{{no}}plumbing and heating
{{chem2|Pb63Sn34Zn3}}

| 170

256{{no|Pb}}{{no}}Poor wetting of aluminium. Poor corrosion rating.
{{chem2|Sn30Pb50Zn20}}

| 177

288{{no|Pb}}{{no}}Kapp GalvRepair Economical solder for repairing & joining most metals including aluminium and cast iron. Has been used for cast iron and galvanized surface repair.{{cite web|title=Kapp GalvRepair|url=http://www.kappalloy.com/tin-zinc-lead-solder.php|publisher=Kapp Alloy & Wire, Inc.|accessdate=23 October 2012|archive-date=1 August 2013|archive-url=https://web.archive.org/web/20130801011931/http://www.kappalloy.com/tin-zinc-lead-solder.php|url-status=dead}}
{{chem2|Sn33Pb40Zn28}}

| 230

275{{no|Pb}}{{no}}Economical solder for repairing & joining most metals including aluminium and cast iron. Has been used for cast iron and galvanized surface repair.
{{chem2|Pb97.5Ag1.5Sn1}}

| colspan=2 | 309

{{no|Pb}}{{yes}}Ag1.5, ASTM1.5S. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable. Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold. Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures.
{{chem2|Pb96Sn2Ag2}}

| 252

295{{no|Pb}}Pb96
{{chem2|Pb95.5Sn2Ag2.5}}

| 299

304{{no|Pb}}{{no}}
{{chem2|Pb93.5Sn5Ag1.5}}

| 296
305

301
306		{{no|Pb}}{{no}}Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than {{chem2|Pb95Sn5}}.
{{chem2|Pb92.5Sn5Ag2.5}}

| 287
299

296
304		{{no|Pb}}{{no}}Pb93.
{{chem2|Pb92Sn5.5Ag2.5}}

| 286

301{{no|Pb}}{{no}}For higher-temperature applications.
{{chem2|Pb90Sn5Ag5}}

| colspan=2 | 292

{{no|Pb}}{{yes}}
{{chem2|Pb88Sn10Ag2}}

| 268
267

290
299{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=5ef2e290b637430483aab758ac193f3c|title=Indium Corp. Indalloy® 228 Pb-Sn-Ag Solder Alloy|accessdate=20 July 2016}}		{{no|Pb}}{{no}}Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold. Forms a eutectic phase, not recommended for operation above 120 °C.
{{chem2|Pb80Sn18Ag2}}

| 252

260{{no|Pb}}{{no}}Used for soldering iron and steel
{{chem2|Pb54Sn45Ag1}}

| 177

210{{no|Pb}}exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel
{{chem2|Sn56Pb39Ag5}}

| colspan=2 |

{{no|Pb}}
{{chem2|Sn62.5Pb36Ag2.5}}

| colspan=2 | 179

{{no|Pb}}{{yes}}
{{chem2|Sn62Pb36Ag2}}

| colspan=2 | 179

{{no|Pb}}{{yes}}Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to {{chem2|Sn60Pb40}} or {{chem2|Sn63Pb37}}. Crystals of {{chem2|Ag3Sn}} may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics.{{cite book|url=https://books.google.com/books?id=MvSMg5HC1YcC&pg=PA164|title=Solders and soldering: materials, design, production, and analysis for reliable bonding|publisher=McGraw-Hill Professional|page=164|author=Howard H. Manko|isbn=978-0-07-134417-3|year=2001}} Not recommended for gold. General-purpose.
{{chem2|Sn61Pb36Ag3}}

| colspan=2 | 205{{cite web|url=https://www.kester.com/Portals/0/Documents/Knowledge%20Base/Alloy%20Temperature%20Chart.pdf|title=Alloy Temperature Chart|publisher=Kester|access-date=10 March 2021}}

| {{no|Pb}}

 Often referred as POS61 ({{Langx|ru|ПОС61}}) in Russia (silver may not be necessarily present).
{{chem2|Sn97.5Pb1Ag1.5}}

| colspan=2 | 305 {{citation needed|date=June 2025}}

{{no|Pb}}{{yes}}Important for hybrid circuits assembly.
{{chem2|Sn50Pb48.5Cu1.5}}

| 183

215[http://www.tpub.com/content/logistics/34/39/10/00-577-7594.htm 3439-00-577-7594 Solder, Tin Alloy]. Tpub.com. Retrieved 2010-07-06.{{no|Pb}}{{no}}Savbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires.
{{chem2|Sn60Pb39Cu1}}

| colspan=2 |

{{no|Pb}}{{no}}
{{chem2|Sn60Pb38Cu2}}

| 183

190{{no|Pb}}Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.
{{chem2|Sn62Pb37Cu1}}

| colspan=2 | 183[http://www.kovopb.cz/userdata/pages/12/dp-solders_pb.pdf Pajky_vkladanylist_Cze_ang_2010.indd]. (PDF). Retrieved 2010-07-06.

{{no|Pb}}{{yes}}Similar to {{chem2|Sn63Pb37}}. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.
{{chem2|Sn63Pb37P0.0015\–0.04}}

| colspan=2 | 183{{cite web|url=http://www.balverzinn.com/downloads/Solder_Sn63PbP.pdf|title=Balver Zinn Solder Sn63PbP|author=|date=|website=balverzinn.com|accessdate=27 March 2018|archive-date=7 July 2011|archive-url=https://web.archive.org/web/20110707210112/http://www.balverzinn.com/downloads/Solder_Sn63PbP.pdf|url-status=dead}}

{{no|Pb}}{{yes}}Sn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam.
{{chem2|Pb80Sn12Sb8}}

| colspan=2 |

{{no|Pb}}{{no}}Used for soldering iron and steel
{{chem2|Pb80Sb15Sn5}}

| colspan=2 | {{convert|570|F|C|sigfig=2|order=flip|disp=out|abbr=values}}

{{no|Pb}}White Metal Capping. Used for locking mineshaft winding ropes into their tapered end sockets or 'capels'.{{Cite book

|title=Mechanical Engineering

|series=Coal Mining Series

|publisher=Virtue |location=London

|year=1959

|edition=2nd

|author=T R Barnard

|chapter=Winding Ropes and Guide Ropes

|pages=374–375

}}

{{chem2|Pb79Sn20Sb1}}

| 184

270{{no|Pb}}{{no}}Sb1
{{chem2|Pb68Sn30Sb2}}

| 185

243{{no|Pb}}{{no}}Pb68
{{chem2|Pb63Sn35Sb2}}

| 185

243{{no|Pb}}{{no}}Sb2
{{chem2|Pb55Sn43.5Sb1.5}}

| colspan=2 |

{{no|Pb}}{{no}}General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.
rowspan=2 | {{chem2|Pb97.5Ag2.5}}

| colspan=2 | 303
304

| rowspan=2 {{no|Pb}}

| rowspan=2 {{yes}}

| rowspan=2 | Ag2.5, UNS L50132. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints.{{cite book|url=https://books.google.com/books?id=gW6zNhhy5ZQC&pg=PA114|title=Symposium on Solder |page=114|publisher=ASTM International|year=1957|isbn=}} Torch solder.

304579{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=299122b40d9246bfa960a15e875d1464|title=97.5Pb-2.5Ag Lead-Silver Solder, ASTM Class 2.5S UNS L50132|accessdate=20 July 2016}}
{{chem2|Pb96Ag4}}

| colspan=2 | 305

{{no|Pb}}high-temperature joints{{cite book|url=https://books.google.com/books?id=M5BWtQ-xjeUC&pg=PA445 |title=Engineering design: a practical guide |page=445|author1=Madara Ogot |author2=Gul Okudan-Kremer |isbn=978-1-4120-3850-8|year=2004|publisher=Trafford }}
{{chem2|Pb95Ag5}}

| 305

364{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=7a0646b6fbce4f79b2cee716edc3f66f|title=Indium Corp. Indalloy 175 Lead Solder Alloy|accessdate=20 July 2016}}{{no|Pb}}{{no}}
{{chem2|Pb94.5Ag5.5}}

| 305
304

364
343{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=0225ffa15e7e4a87a61bf164dc0f77e1|title=94.5Pb-5.5Ag Lead-Silver Solder, ASTM Class 5.5S; UNS L50180|accessdate=20 July 2016}}		{{no|Pb}}{{no}}Ag5.5, UNS L50180
{{chem2|Sn}}

| colspan=2 | 232

{{yes}}{{n/a|Pure}}Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying. Susceptible to tin pest.
{{chem2|Sn91Zn9}}

| colspan=2 | 199

{{yes}}{{yes}}KappAloy9 Designed specifically for aluminium-to-aluminium and aluminium-to-copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Best solder for aluminium wire to Copper busses or copper wire to aluminium busses or contacts.{{cite web|title=KappAloy|url=http://www.kappalloy.com/tin-zinc-solder.php|publisher=Kapp Alloy & Wire, Inc.|accessdate=23 October 2012|archive-date=16 July 2013|archive-url=https://web.archive.org/web/20130716160420/http://kappalloy.com/tin-zinc-solder.php|url-status=dead}} UNS#: L91090
{{chem2|Sn85Zn15}}

| 199

260{{yes}}{{no}}KappAloy15 Designed specifically for aluminium-to-aluminium and aluminium-to-copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Has a wide plastic range this makes it ideal for hand soldering aluminium plates and parts, allowing manipulation of the parts as the solder cools.
{{chem2|Sn80Zn20}}

| 199

288{{yes}}{{no}}KappAloy20 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.
{{chem2|Sn70Zn30}}

| 199

316{{yes}}{{no}}KappAloy30 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other
{{chem2|Sn60Zn40}}

| 199

343{{yes}}{{no}}KappAloy40 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.
{{chem2|Zn60Sn40}}

| 199

341{{yes}}{{no}}For soldering aluminium. Good wetting.
{{chem2|Zn70Sn30}}

| 199

376{{yes}}{{no}}For soldering aluminium. Excellent wetting. Good strength.
{{chem2|Zn95Sn5}}

| colspan=2 | 382

{{yes}}yes?For soldering aluminium. Excellent wetting.
{{chem2|Sn90Zn7Cu3}}

| 200

222{{yes}}{{no}}Kapp Eco-Babbitt Commonly used in capacitor manufacturing as protective coating to shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor, to prevent current and charge leakage out of and within the layers of the capacitor, and to prevent the development of electron flows within the coating material itself, that would diminish capacitor performance, coating, and capacitor life.{{cite web|author=Kapp Alloy|title=Kapp Eco Babbitt|url=http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=54254&component=catalog&catalog_id=18662|accessdate=4 April 2013}}
{{chem2|Sn50Zn49Cu1}}

| 200

300{{yes}}{{no}}Galvanite Lead-free galvanizing solder formulation designed specifically for high quality repairs to galvanized steel surfaces. Simple, effective and easy to use, in both manufacturing and field applications. Metallurgically bonds to the steel, for a seamless protective barrier.{{cite web|publisher=Kapp Alloy & Wire, Inc.|title=Galvanite|url=http://www.kappalloy.com/galvanite-solder.php|accessdate=23 October 2012|archive-date=19 August 2014|archive-url=https://web.archive.org/web/20140819130324/http://www.kappalloy.com/galvanite-solder.php|url-status=dead}}
{{chem2|Sn95Ag3.5Zn1Cu0.5}}

|

221{{yes}}{{no}}
{{chem2|Sn98Ag2}}

| colspan=2 |

{{yes}}
{{chem2|Sn96.5Ag3.5}}

| colspan=2 | 221

{{yes}}{{yes}}{{chem2|Sn96}}, {{chem2|Sn96.5}}, 96S. Fine lamellar structure of densely distributed {{chem2|Ag3Sn}}. Annealing at 125 °C coarsens the structure and softens the solder. Creeps via dislocation climb as a result of lattice diffusion. Used as wire for hand soldering rework; compatible with {{chem2|SnCu0.7}}, {{chem2|SnAg3Cu0.5}}, {{chem2|SnAg3.9Cu0.6}}, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry.{{cite book|url=https://books.google.com/books?id=z4Ha0AYdon4C&pg=PA110 |title=Lead-free electronics |publisher=Wiley|author1=Sanka Ganesan |author2=Michael Pecht |isbn=978-0-471-78617-7|year=2006|page=110}} Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations. High tin content allows absorbing significant amount of gold without embrittlement.{{cite web |url=http://www.aimsolder.com/specialty-materials-division-solders-photonic-packing |title=Solder selection for photonic packaging |date=27 February 2013 |accessdate=20 August 2016|publisher=AIM Metals & Alloys}}
{{chem2|Sn96Ag4}}

| 221

229{{yes}}{{no}}ASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.
{{chem2|Sn95Ag5}}

| 221

254{{cite web|title=KappZapp|url=http://www.kappalloy.com/zapp-solder.php|publisher=Kapp Alloy & Wire, Inc.|accessdate=25 October 2012|archive-date=18 July 2012|archive-url=https://web.archive.org/web/20120718151548/http://www.kappalloy.com/zapp-solder.php|url-status=dead}}{{yes}}{{no}}Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless.
{{chem2|Sn94Ag6}}

| 221

279{{yes}}{{no}}Produces strong and ductile joints on copper and stainless steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on sStainless.
{{chem2|Sn93Ag7}}

| 221

302{{yes}}{{no}}Produces strong and ductile joints on copper and stainless steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 31,000 psi on stainless. Audio industry standard for vehicle and home theater speaker installations. Its 7% silver content requires a higher temperature range, but yields superior strength and vibration resistance.{{cite web|title=KappZapp7|url=http://www.solderdirect.com/all-products/non-aluminum-soldering/kappzapp/kappzapp7tm.html|publisher=SolderDirect.com|accessdate=25 October 2012|archive-date=13 August 2013|archive-url=https://web.archive.org/web/20130813025657/http://www.solderdirect.com/all-products/non-aluminum-soldering/kappzapp/kappzapp7tm.html|url-status=dead}}
{{chem2|Sn90Au10}}

| colspan=2 | 217{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=ec6a4e98e2294ead8788107da410c9d8|title=Indium Corp. Indalloy® 238 Sn-Au Solder Alloy|accessdate=20 July 2016}}

{{yes}}{{yes}}
{{chem2|Au80Sn20}}

| colspan=2 | 280

{{yes}}{{yes}}Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature.{{cite web|url=http://www.indium.com/_dynamo/download.php?docid=298|title=Indium Corporation Global Solder Supplier Electronics Assembly Materials|date=|website=Indium Corporation|accessdate=27 March 2018|archive-date=29 September 2011|archive-url=https://web.archive.org/web/20110929033419/http://www.indium.com/_dynamo/download.php?docid=298|url-status=dead}} Forms a mixture of two brittle intermetallic phases, AuSn and {{chem2|Au5Sn}}.{{cite web |url=http://www.chipscalereview.com/issues/1004/article.php?type=feature&article=f3 |title=Chip Scale Review Magazine |publisher=Chipscalereview.com |date=2004-04-20 |accessdate=2010-03-31 |archive-date=2011-07-08 |archive-url=https://web.archive.org/web/20110708145436/http://www.chipscalereview.com/issues/1004/article.php?type=feature&article=f3 |url-status=dead }} Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability. One of the best materials for soldering in optoelectronic devices and components packaging. Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150 °C.{{cite web|url=http://www.indium.com/gold/files/2010/12/98217.pdf|title=High-Temperature Gold Solder & Braze Materials|publisher=Indium Corporation|accessdate=27 March 2018|archive-date=19 July 2011|archive-url=https://web.archive.org/web/20110719145615/http://www.indium.com/gold/files/2010/12/98217.pdf|url-status=dead}} Good ductility. Also classified as a braze.
{{chem2|Sn99.3Cu0.7}}

| colspan=2 | 228

{{yes}}{{yes}}Sn99Cu1. Also designated as {{chem2|Sn99Cu1}}. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed {{chem2|Cu6Sn5}}.{{cite book|url=https://books.google.com/books?id=z4Ha0AYdon4C&pg=PA110 |title=Lead-free electronics |publisher=Wiley|author1=Sanka Ganesan |author2=Michael Pecht |isbn=978-0-471-78617-7|year=2006|page=404}} Forms large dendritic ß-tin crystals in a network of eutectic microstructure with finely dispersed {{chem2|Cu6Sn5}}. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest. Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modified or nickel stabilized.{{cite web |url=http://www.aimsolder.com/sites/default/files/the_fluidity_of_the_ni-modified_sn-cu_eutectic_lead-free_solder_white_paper.pdf |title=The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-Free Solder |author=Keith William Sweatman and Tetsuro Nishimura|date=January 2006|publisher=Nihon Superior Co., Ltd}}
{{chem2|Sn97Cu3}}

| 227
232

250[http://www.balverzinn.com/downloads/Solder_Sn97Cu3.pdf Balver Zinn Solder Sn97Cu3] {{webarchive|url=https://web.archive.org/web/20110707210148/http://www.balverzinn.com/downloads/Solder_Sn97Cu3.pdf |date=2011-07-07 }}
332		{{yes}}For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing.
{{chem2|Sn99Cu0.7Ag0.3}}

| 217

228{{cite web|url=http://www.balverzinn.com/downloads/Solder_SCA.pdf|title=Balver Zinn Solder SCA (SnCu0.7Ag0.3)|author=|date=|website=balverzinn.com|accessdate=27 March 2018|archive-date=7 July 2011|archive-url=https://web.archive.org/web/20110707210235/http://www.balverzinn.com/downloads/Solder_SCA.pdf|url-status=dead}}{{yes}}{{no}}SCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with {{chem2|Sn96.2Ag3.8}} alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.
{{chem2|Sn99Ag0.3Cu0.7}}

| colspan=2 |

{{yes}}
{{chem2|Sn98.5Ag1.0Cu0.5}}

| 220

225{{yes}}{{partial|Near}}SAC105 alloy contains the least amount of silver among lead-free solders. It is compatible with all flux types and is relatively inexpensive; it exhibits good fatigue resistance, wetting and solder joint reliability
{{chem2|Sn97Cu2.75Ag0.25}}

| 228

314{{yes}}High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors.
{{chem2|Sn96.5Ag3.0Cu0.5}}

| 217

220
218{{cite journal

| last1 = Alakayleh

| first1 = Abdallah

| last2 = Hamasha

| first2 = Sa'd

| last3 = Alahmer

| first3 = Ali

| title = The impact of paste alloy, paste volume, and surface finish on solder joint reliability

| journal = Microelectronics Reliability

| volume = 158

| year = 2024

| pages = 111112

| publisher = Elsevier

| doi = 10.1016/j.microrel.2024.111112

| url = https://www.sciencedirect.com/science/article/pii/S0026271424001379

}}{{cite web|url=http://www.balverzinn.com/tl_files/balverzinn/downloads/datenblaetter_en/Solder%20SN97C.pdf|title=Balver Zinn Solder SN97C (SnAg3.0Cu0.5)|website=balverzinn.com|accessdate=27 March 2018|archive-date=24 December 2012|archive-url=https://web.archive.org/web/20121224043938/http://www.balverzinn.com/tl_files/balverzinn/downloads/datenblaetter_en/Solder%20SN97C.pdf|url-status=dead}}

{{yes}}{{partial|Near}}SAC305. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with {{chem2|Sn97Ag3}} alloy. Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. Weakens at thermal cycling, concern of whisker growth, large {{chem2|Ag3Sn}} intermetallic platelet precipitates causing mechanical weakening and poor shock/drop performance. Tendency to creep.Karl Seelig (2017) [https://www.smta.org/chapters/files/SMT_New_Pb-Free_Solder_Alloy_for_Demanding_Applications_SMTA_GDL_2017.pdf New Pb-Free Solder Alloy for Demanding Applications]. VP Technology, AIM Solder
{{chem2|Sn95.8Ag3.5Cu0.7}}

| 217

218{{yes}}{{partial|Near}}SN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with {{chem2|Sn96.5Ag3.5}} alloy (designated e.g. {{chem2|SN96Ce}}). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.
{{chem2|Sn95.6Ag3.5Cu0.9}}

| colspan=2 | 217

{{yes}}{{yes}}Determined by NIST to be truly eutectic.
{{chem2|Sn95.5Ag4Cu0.5}}

| colspan=2 | 217{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=19662ece2a4a4bb2bbe7aa522f916185|title=Indium Corp. Indalloy® 246 95.5Sn/4.0Ag/0.5Cu Lead-Free Solder Alloy|accessdate=20 July 2016}}

{{yes}}{{yes}}SAC405. Lead-Free, Cadmium free formulation designed specifically to replace lead solders in copper and stainless steel plumbing, and in electrical and electronic applications.
{{chem2|Sn95.5Ag3.9Cu0.6}}

| colspan=2 | 217{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=a811b22a9ddd406d88a92130ebc9a9f0|title=Indium Corp. Indalloy® 252 95.5Sn/3.9Ag/0.6Cu Lead-Free Solder Alloy|accessdate=20 July 2016}}

{{yes}}{{yes}}Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for {{chem2|Sn10Pb90}}. Solder paste for rework of BGA boards. Alloy of choice for general SMT assembly.
{{chem2|Sn95.5Ag3.8Cu0.7}}

| colspan=2 | 217{{cite web|url=http://www.balverzinn.com/downloads/Solder_SN96C.pdf|title=Balver Zinn Solder SN96C (SnAg3,8Cu0,7)|author=|date=|website=balverzinn.com|accessdate=27 March 2018|archive-date=7 July 2011|archive-url=https://web.archive.org/web/20110707210219/http://www.balverzinn.com/downloads/Solder_SN96C.pdf|url-status=dead}}

{{yes}}{{partial|Near}}SN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with {{chem2|Sn96.2Ag3.8}} alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.
{{chem2|Sn95.5Cu4Ag0.5}}

| 226

260{{yes}}{{no}}KappFree provides good joint strength, vibration resistance, and thermal cycle fatigue resistance in both piping and electrical products as opposed to tin-lead solders. Higher working temperature. Wets well to brass, copper, and stainless steel. Good electrical conductivity.{{cite web|publisher=Kapp Alloy & Wire, Inc.|title=KappFree|url=http://www.kappalloy.com/kappfree-elec-solder.php|accessdate=2 March 2015|archive-date=1 August 2013|archive-url=https://web.archive.org/web/20130801023905/http://www.kappalloy.com/kappfree-elec-solder.php|url-status=dead}}
{{chem2|Sn95Ag4Cu1}}

| colspan=2 |

{{yes}}
{{chem2|Sn90.7Ag3.6Cu0.7Cr5}}

| 217

1050{{cite journal|journal=ACS Nano |date=2015|volume= 9|issue=8|pages=8099–107|title=Soldering of carbon materials using transition metal rich alloys|author=M. Burda |display-authors=etal |doi=10.1021/acsnano.5b02176|pmid = 26256042}}{{yes}}{{no}}C-Solder. Lead-free, low-temperature soldering alloy for joining of various carbon materials including carbon fibres and carbon nanotube fibres in both carbon-carbon and carbon-metal arrangements. Produces mechanically strong and electrically conductive bonds. Provides wetting of carbon{{cite web|url=http://www.cametics.com/resources/upload/data%20sheets/Cametics%20C-SOLDER%20Technical%20data%20sheet%20-%20August%202016.pdf|title=Technical Data Sheet, Cametics C-Solder active soldering alloy|author=|date=|website=cametics.com|accessdate=27 March 2018}} and other materials generally considered as difficult to solder, including aluminium, stainless steel, titanium, glass, and ceramics.
{{chem2|Sn65Ag25Sb10}}

| colspan=2 | 233

{{yes}}{{yes}}Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder.
{{chem2|Sn96.2Ag2.5Cu0.8Sb0.5}}

| 217

225{{yes}}Ag03A. Patented by AIM alliance.
{{chem2|Sn95.25Ag3.8Cu0.7Sb0.25}}

| colspan=2 |

{{yes}}Preferred by the European IDEALS consortium for wave soldering.
{{chem2|Sn99.3Cu0.7Ni0.05Ge0.009}}

| colspan=2 | 227[https://www.aimsolder.com/sites/default/files/alloy_sn100c_tds.pdf SN100C® LEAD-FREE SOLDER ALLOY]. aimsolder.com

{{yes}}Sn100C, a lead-free silver-free nickel-stabilized alloy. Similar to Sn99Cu1. The nickel content lowers copper erosion and promotes shiny solder fillet. The presence of germanium promotes flow and reduces dross formation. Performance similar to SAC alloys at lower cost. Dross formation rate comparable to lead-tin alloys.
{{chem2|Sn99Sb1}}

| 232

235{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=6b43308933eb48bba5f38c1217c73ce3|title=Indium Corp. Indalloy® 129 99Sn/1Sb Lead-Free Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}
{{chem2|Sn97Sb3}}

| 232

238{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=fc88a689e7ab481194cc1c5a1e2eb6a1|title=Indium Corp. Indalloy® 131 97Sn/3Sb Lead-Free Solder Alloy|accessdate=20 July 2016}}{{yes}}{{no}}
{{chem2|Sn95Sb5}}

| 235
232

240{{yes}}{{no}}Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than {{chem2|SnAg3.5}}. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.{{cite book|url=https://books.google.com/books?id=H75TywRXUK4C&pg=PA541|title=Handbook of lead-free solder technology for microelectronic assemblies|publisher=CRC Press|page=541|author1=Karl J. Puttlitz |author2=Kathleen A. Stalter |isbn=978-0-8247-4870-8|year=2004}} High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications. Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs.
{{chem2|Zn100}}

| colspan=2 | 419

{{yes}}{{n/a|Pure}}For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.{{cite book|author=Howard H. Manko|title=Solders and soldering: materials, design, production, and analysis for reliable bonding|url=https://books.google.com/books?id=MvSMg5HC1YcC&pg=PA396|date=2001|publisher=McGraw-Hill Professional|isbn=978-0-07-134417-3|pages=396–}}
{{chem2|Zn95Al5}}

| colspan=2 | 382

{{yes}}{{yes}}For soldering aluminium. Good wetting.
{{chem2|Au87.5Ge12.5}}

| colspan=2 | 361
356

{{yes}}{{yes}}Au88. Used for die attachment of some chips. The high temperature may be detrimental to the chips and limits reworkability.
{{chem2|Au98Si2}}

| 370

800{{yes}}Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow.
{{chem2|Au96.8Si3.2}}

| 370

363{{cite web|url=http://www.matweb.com/search/DataSheet.aspx?MatGUID=ac3061509fca4befa1191973be39cd62|title=Indium Corp. Indalloy 184 Gold Solder Alloy|accessdate=20 July 2016}}{{yes}}{{yes}}Au97. {{chem2|AuSi3.2}} is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.

= Notes on the above table =

In the Sn-Pb alloys, tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.

For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no impurities that could cause doping in the wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used.

Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.

= Properties =

The thermal conductivity of common solders ranges from 30 to 400 W/(m·K), and the density from 9.25 to 15.00 g/cm3.{{cite web|url=http://www.engineersedge.com/properties_of_metals.htm|title=Thermal Properties of Metals, Conductivity, Thermal Expansion, Specific Heat – Engineers Edge|accessdate=20 July 2016}}{{cite web|title=Database for Solder Properties with Emphasis on New Lead-free Solders |url=http://www.metallurgy.nist.gov/solder/NIST_LeadfreeSolder_v4.pdf |date=2012-07-10|accessdate=2013-06-08|publisher=metallurgy.nist.gov}}

class="wikitable sortable"
Material

! Thermal conductivity
(W/m·K)

! data-sort-type="number" | Melting point
(°C)

Sn-37Pb (eutectic)50.9 183
Sn-0.7Cu53227
Sn-2.8Ag-20.0In53.5 175–186
Sn-2.5Ag-0.8Cu-0.5Sb57.26 215–217
Pb-5Sn63 310
Lead (Pb)35.0 327.3
Tin (Sn)73.0 231.9
Aluminium (Al)240 660.1
Copper (Cu)393–401 1083
FR-41.7

References

{{Reflist|30em|refs=

{{cite journal|year=2019|volume=20|issue=1|pages=421–444|author=Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun|title=Structure and properties of Sn-Cu lead-free solders in electronics packaging|journal=Science and Technology of Advanced Materials|doi=10.1080/14686996.2019.1591168|pmid=31489052|pmc=6711112|bibcode=2019STAdM..20..421Z }} {{open access}}

{{cite journal|year=2019|volume=20|issue=1|pages=876–901|author=Nan Jiang |title=Reliability issues of lead-free solder joints in electronic devices|journal=Science and Technology of Advanced Materials|doi=10.1080/14686996.2019.1640072|pmid=31528239|pmc=6735330|bibcode=2019STAdM..20..876J }} {{open access}}

}}

External links

{{commons category|Soldering}}

  • [http://www.metallurgy.nist.gov/phase/solder/solder.html Phase diagrams of different types of solder alloys]

Category:Fusible alloys

Category:Soldering

Category:Lead alloys