TO-263

{{Short description|Surface mount power semiconductor package}}

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The Double Decawatt Package,{{Cite web|title=D2PAK or DDPAK - Double Decawatt Package|url=https://eesemi.com/d2pak.htm|access-date=2021-06-29|website=eesemi.com}}{{Cite web|date=2015-04-07|title=TO-263 Component Package|url=https://blog.mbedded.ninja/pcb-design/component-packages/to-263-component-package/|access-date=2021-06-29|website=blog.mbedded.ninja|language=en-us}} D2PAK, SOT404 or DDPAK, standardized as TO-263,{{Cite web|title=TO-263 Standard|url=https://www.jedec.org/document_search?search_api_views_fulltext=to-263|access-date=2021-06-29|publisher=JEDEC}} is a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation{{Cite web|title=D2PAK (TO-263) MOSFET Power Discrete|url=https://amkor.com/packaging/power-discrete/d2pak-to-263/|access-date=2021-06-29|website=Amkor Technology|language=en-US}} but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals.

Image:D2PAK.JPG|A pair of MOSFETs in the surface-mount package D2PAK.

Image:TO263 beside TO220.JPG|A TO-220 package compared to a D2PAK package.

Dimensions

Variants

Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2 mm instead of the standard 4.5 mm.{{Cite web|title=AN-1797 TO-263 THIN Package|url=https://www.ti.com/lit/an/snva328a/snva328a.pdf|access-date=29 June 2021|website=Texas instruments|type=pdf}}

See also

References

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