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TO-66

{{short description|Smaller variant of the TO-3 package}}

{{distinguish|1996 TO66}}

File:GD241 Transistor.jpg

File:TO-3 vs TO-66 cm.jpg

TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller.{{Citation

| last =

| first =

| year = 2008

| title = TO-66 package details

| publisher = Central Semiconductor Corp.

| location =

| page =

| url = http://www.centralsemi.com/PDFS/CASE/TO-66PD.PDF

| accessdate = 2013-12-09

}} The TO-66 package is made entirely of metal and is commonly used by silicon controlled rectifiers and power transistors.{{cite web |title=TO-66 Package |url=http://eesemi.com/to66.htm |website=EESemi.com |accessdate=8 February 2019}}

In Europe, it was popularly used by the complementary germanium power transistors AD161/AD162.

The TO-66 package consists of a diamond-shaped base plate with diagonals of {{convert|31.4|mm|abbr=on}} and {{convert|19.0|mm|abbr=on}}. The plate has two mounting holes on the long diagonal, with the centers spaced {{convert|23|mm|abbr=on}} apart. A cap attached to one side of the plate and under which the semiconductor chip is located, brings the total height to up to {{convert|8.63|mm|abbr=on}}. Two pins on the other side of the plate are isolated from the package by individual glass-metal seals. The metal case forms the third connection (in the case of a bipolar junction transistor this is typically the collector).

Variants

TO-66 is often used as a synonym for any of the variants that have the same footprint (i.e. position of mounting holes and pins) as TO-66.

=TO-123=

TO-123 reduces the maximum thickness of the base plate from {{convert|1.90|mm|abbr=on}} to {{convert|1.02|mm|abbr=on}}.{{cite web |url=http://www.jedec.org/sites/default/files/docs/archive/to/to-123.pdf |archive-url=https://web.archive.org/web/20160410042016/http://www.jedec.org/sites/default/files/docs/archive/to/to-123.pdf |archive-date=2016-04-10 |title=TO-123 |website=JEDEC |accessdate=2021-06-28}}

=TO-124=

TO-124 increases the maximum thickness of the base plate from {{convert|1.90|mm|abbr=on}} to {{convert|2.59|mm|abbr=on}} and the maximum total height from {{convert|8.63|mm|abbr=on}} to {{convert|9.02|mm|abbr=on}}.{{cite web |url=http://www.jedec.org/sites/default/files/docs/archive/to/to-124.pdf |archive-url=https://web.archive.org/web/20160405021043/http://www.jedec.org/sites/default/files/docs/archive/to/to-124.pdf |archive-date=2016-04-05 |title=TO-124 |website=JEDEC |accessdate=2021-06-28}}

=TO-213=

TO-213 is intended to replace previous definitions of flange-mounted packages with a {{convert|5.08|mm|abbr=on}} pin spacing.{{cite book |url=https://www.jedec.org/system/files/docs/To-213a.pdf |url-access=registration |title=JEDEC Publication No. 95 |chapter=Flange Mounted Header Family 0.200 Pin Spacing |publisher=JEDEC |pages=200–201 |date=September 1976 |accessdate=2021-07-13}} The different outlines are now defined as variants of TO-213: TO-66 is renamed to TO-213-AA, TO-123 to TO-213-AB, TO-124 to TO-213-AC.

National standards

class="wikitable sortable"

!rowspan=2|Standards organization

!rowspan=2|Standard

!colspan=3|Designation for

TO-66

!TO-123

!TO-124

JEDEC

|JEP95

|TO-213-AA

|TO-213-AB

|TO-213-AC

IEC

|IEC 60191{{efn|name=bc|These standards have separate drawings for the package case and the base.}}{{cite web |url=https://datasheet.datasheetarchive.com/originals/scans/Scans-110/150.pdf |title=Semiconductors |publisher=Pro Electron |date=1978 |page=215 |accessdate=2021-06-17}}

|

|

|C13/B16{{efn|name=h98|The maximum height is {{convert|9.8|mm|abbr=on}}.}}

EIAJ / JEITA

|ED-7500A{{efn|name=bc}}{{cite web |url=https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf |title=EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices |publisher=JEITA |date=1996 |access-date=2021-06-14}}

|TC-16A/TB-12

| –

|TC-9/TB-12{{efn|name=h98}}

British Standards

|BS 3934{{efn|name=bc}}{{cite web |url=https://the-eye.eu/public/Books/Electronic%20Archive/MullardBook1Part11974_text.pdf |title=Mullard Technical Handbook Book 1 Part 1 |publisher=Mullard |date=1974 |page=142 |access-date=2021-06-14 |archive-url=https://web.archive.org/web/20201122182049/https://the-eye.eu/public/Books/Electronic%20Archive/MullardBook1Part11974_text.pdf |archive-date=2020-11-22}}

|

|

|SO-55/SB2-5{{efn|name=h98}}

Gosstandart

|GOST 18472—88{{cite web |url=https://files.stroyinf.ru/Data2/1/4294834/4294834701.pdf |title=ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры |trans-title=GOST 18472—88 Semiconductor devices - basic dimensions |language=ru |publisher=Rosstandart |date=1988 |page=41 |access-date=2021-06-17}}

|rowspan=2| –

|rowspan=2| –

|rowspan=2|KT-8{{efn|name=h98}}{{efn|{{langx|ru|КТ-8}} }}

Rosstandart

|GOST R 57439{{cite web |url=https://files.stroyinf.ru/Data/644/64413.pdf |title=ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры |trans-title=Semiconductor devices - basic dimensions |language=ru |publisher=Rosstandart |date=2017 |pages=50–51 |access-date=2021-06-17}}

rowspan=2|Kombinat Mikroelektronik Erfurt

|TGL 11811{{cite web |url=https://www.bbr-server.de/bauarchivddr/archiv/tglarchiv/tgl20001bis30000/tgl26501bis27000/tgl-26713-11-jun-1988.pdf |title=TGL 26713/11: Gehäuse für Halbleiterbauelemente - Bauform L |publisher=Verlag für Standardisierung |place=Leipzig |date=June 1988 |language=de |accessdate=2021-06-15}}

| –

| –

|D{{efn|name=h98}}

TGL 26713/11

| –

| –

|L2B{{efn|name=h98}}

{{notelist}}

See also

  • TO-126 - a plastic package with power ratings similar to TO-66

References

{{Reflist}}

External links

  • [http://eesemi.com/to66.htm TO-66 Package], EESemi.com

Category:Semiconductor packages

{{Semiconductor packages}}

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