gate dielectric
{{Short description|Field-effect transistor}}
{{Ref improve|date=December 2006}}
A gate dielectric is a dielectric used between the gate and substrate of a field-effect transistor (such as a MOSFET). In state-of-the-art processes, the gate dielectric is subject to many constraints, including:
- Electrically clean interface to the substrate (low density of quantum states for electrons)
- High capacitance, to increase the FET transconductance
- High thickness, to avoid dielectric breakdown and leakage by quantum tunneling.
The capacitance and thickness constraints are almost directly opposed to each other. For silicon-substrate FETs, the gate dielectric is almost always silicon dioxide (called "gate oxide"), since thermal oxide has a very clean interface. However, the semiconductor industry is interested in finding alternative materials with higher dielectric constants, which would allow higher capacitance with the same thickness.
{{Further|high-κ dielectric}}
History
The earliest gate dielectric used in a field-effect transistor was silicon dioxide (SiO2). The silicon and silicon{{nbsp}}dioxide surface passivation process was developed by Egyptian engineer Mohamed M. Atalla at Bell Labs during the late 1950s, and then used in the first MOSFETs (metal–oxide–semiconductor field-effect transistors). Silicon dioxide remains the standard gate dielectric in MOSFET technology.{{cite journal |last1=Kooi† |first1=E. |last2=Schmitz |first2=A. |title=Brief Notes on the History of Gate Dielectrics in MOS Devices |journal=High Dielectric Constant Materials: VLSI MOSFET Applications |series=Springer Series in Advanced Microelectronics |date=2005 |volume=16 |pages=33–44 |doi=10.1007/3-540-26462-0_2 |publisher=Springer Berlin Heidelberg |isbn=978-3-540-21081-8 |language=en}}
See also
References
{{Reflist}}
{{DEFAULTSORT:Gate Dielectric}}
Category:Semiconductor structures
Category:Field-effect transistors
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