Thin shrink small outline package

They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operational amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.{{cite web |title=TSSOP in STATS ChipPAC datasheet |url=https://datasheetspdf.com/pdf-file/685895/STATSChipPAC/TSSOP/1|access-date=14 December 2020}}

== Physical properties ==

The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.

Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB. In most applications, the exposed pad is connected to ground.{{cite web |title=Exposed pads: a brief introduction |url=https://www.maximintegrated.com/en/design/technical-documents/app-notes/3/3273.html|website=www.maximintegrated.com |access-date=8 January 2021}}

The Heat sink thin shrink small outline package{{cite web |title=Plastic Packages for Integrated Circuits (HTSSOP) |url=https://www.renesas.com/sg/en/document/psc/package-drawing-tssop-ep-20pin-mdp0048|website=www.renesas.com |access-date=8 January 2021}} (HTSSOP) is Texas Instruments name for a TSSOP with an exposed pad on the bottom side.{{cite web |title=TSSOP on mbedded ninja |url=https://blog.mbedded.ninja/pcb-design/component-packages/tssop-component-package/ |website=mbedded ninja |access-date=8 June 2022}} There are some other manufacturers who use the same name.

• List of electronic component packaging types
• Small outline integrated circuit

• Shrink Small Outline Package
• Mini Small Outline Package
• Small outline integrated circuit

{{Reflist}}

{{Commons category|TSSOP integrated circuit packages}}

• [https://jeelabs.org/book/1513c/index.html Soldering a TSSOP chip by hand]

{{Semiconductor packages}}

Category:Semiconductor packages