Thin small outline package

{{short description|Thin surface mount IC package}}

{{distinguish|text=Thin shrink small outline package (TSSOP)}}

{{Refimprove|date=July 2007}}

Image:TSOP 32 (T1) BW.svg

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.

{{cite web|url=http://glacier.lbl.gov/~gtp/DOM/dataSheets/Intel_Packaging.pdf

|title=Small Outline Package Guide

|author=Intel

|page=1-1

|date=1999

|access-date=December 17, 2021

|url-status=dead

|archive-url=https://web.archive.org/web/20170211223522/http://glacier.lbl.gov/~gtp/DOM/dataSheets/Intel_Packaging.pdf

|archive-date=February 11, 2017 }}