Amkor Technology

{{Infobox company

| name = Amkor Technology, Inc.

| logo = Amkor Technology logo (B).svg

| logo_upright = 1.15

| type = Public

| traded_as = {{ubl|{{NASDAQ|AMKR}}|S&P 400 component}}

| ISIN = {{ISIN|sl=n|pl=y|US0316521006}}

| foundation = {{start date and age|1968}}

| founder = Hyang-Soo Kim

| location = Tempe, Arizona, U.S.

| locations = 12

| key_people = {{ubl|Joo-Jin (James) Kim (executive chairman)|John T. Kim|(executive vice chairman)|Giel Rutten (president & CEO){{Cite web|url=https://amkor.com/leadership/giel-rutten/|title = Giel Rutten}}{{cite news|author=Jeff Gifford|date=June 18, 2020

|url=https://www.bizjournals.com/phoenix/news/2020/06/18/amkor-technology-names-new-ceo.html|title=Valley semiconductor company names new CEO|work=Phoenix Business Journal}}|Megan Faust}} (corporate VP & CFO)

| industry = Semiconductors & Related Devices

| products =

| services =

| revenue = {{nowrap|{{decrease}} {{US$|6.50 billion|link=yes}} (2023)}}

| operating_income = {{nowrap|{{decrease}} US$470 million (2023)}}

| net_income = {{nowrap|{{decrease}} US$362 million (2023)}}

| assets = {{nowrap|{{decrease}} US$6.77 billion (2023)}}

| equity = {{nowrap|{{increase}} US$3.96 billion (2023)}}

| num_employees = 28,700

| num_employees_year = 2023

| website = {{URL|https://amkor.com/}}

| footnotes = {{cite web|language=en|url=https://amkor.com/company-history/|title=Amkor Technology – Company History|accessdate=2018-01-08}}{{cite web|url=https://www.sec.gov/ix?doc=/Archives/edgar/data/1047127/000104712724000019/amkr-20231231.htm|title=US SEC: Form 10-K 2013|publisher=U.S. Securities and Exchange Commission|date=February 16, 2024|accessdate=February 17, 2024}}

}}

Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States.{{Cite web |title=Amkor’s outlook improved as it moves headquarters |url=http://www.eetimes.com/document.asp?doc_id=1154492 |website=EETimes}} The company's Arizona headquarters was originally in Chandler,{{Cite web |date=2023-12-05 |title=Amkor relocates to Arizona - Philadelphia Business Journal |url=https://www.bizjournals.com/philadelphia/stories/2005/05/30/daily22.html |access-date=2023-12-05 |archive-url=https://web.archive.org/web/20231205224134/https://www.bizjournals.com/philadelphia/stories/2005/05/30/daily22.html |archive-date=2023-12-05 |url-status=live }} then later moved to Tempe. The company was founded in 1968 and, {{as of|2022|lc=y}}, has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.

With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.

Etymology

Amkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea".{{Cite web |accessdate=January 27, 2024 |title=Company History |website=Amkor Technology |url=https://amkor.com/company-history/}}

History

Amkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq.

In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in United States.{{cite web |title=2000 Annual Report |url=https://ir.amkor.com/static-files/66342555-f20a-4916-ab48-758ce2bcd241 |website=Amkor Technology |archive-url=https://web.archive.org/web/20230209095222/https://ir.amkor.com/static-files/66342555-f20a-4916-ab48-758ce2bcd241 |archive-date=February 9, 2023 |date=2001 |url-status=live}} In 2005, Amkor spun off Integra Technologies.{{cite web |title=Amkor spin-off Integra focuses on test |url=https://www.eetimes.com/amkor-spin-off-integra-focuses-on-test/ |publisher=EE Times |archive-url=https://web.archive.org/web/20230209112659/https://www.eetimes.com/amkor-spin-off-integra-focuses-on-test/ |archive-date=February 9, 2023 |date=October 10, 2005 |url-status=live}}

In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan.{{Cite web |date=February 11, 2016 |title=Amkor Tech finishes 100 percent buy of a Japanese semiconductor company |url=https://www.bizjournals.com/phoenix/blog/techflash/2016/02/amkor-tech-finishes-100-percent-buy-of-a-japanese.html |access-date=2025-05-09 |website=bizjournals.com}}{{Cite web |date=May 24, 2017 |title=Amkor Completes Semiconductor Packaging Firm Nanium's Buyout |url=https://www.nasdaq.com/articles/amkor-completes-semiconductor-packaging-firm-naniums-buyout-2017-05-24 |website=nasdaq.com}}

In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year.{{Cite news|url=https://www.bloomberg.com/press-releases/2017-06-15/amkor-technology-recognized-as-supplier-of-the-year-for-second-consecutive-year-by-qualcomm|title=Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm|last=|first=|date=15 June 2017|newspaper=Bloomberg.com|url-status=live|archive-url=https://web.archive.org/web/20200317191706/https://www.bloomberg.com/press-releases/2017-06-15/amkor-technology-recognized-as-supplier-of-the-year-for-second-consecutive-year-by-qualcomm |archive-date=2020-03-17 |access-date=2020-03-17}}

Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan.{{Cite web|url=https://electroiq.com/2018/09/amkor-opens-new-semiconductor-package-manufacturing-and-test-plant-in-taiwan/|title=Amkor opens new semiconductor package manufacturing and test plant in Taiwan {{!}} Solid State Technology|website=electroiq.com|language=en-US|access-date=2018-09-25}}

In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.

ASE Technology – $11.87 Billion
Amkor Technology – $7.1 Billion
JCET – $3.97 Billion
SPIL – $2.79 Billion
Powertech Technology – $2.17 Billion

A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023.{{cite web|access-date=2023-12-20 |date=2023-11-30 |title=Amkor to build $2 billion Arizona semiconductor packaging plant |publisher=reuters.com |url=https://www.reuters.com/technology/amkor-build-2-billion-arizona-semiconductor-packaging-plant-2023-11-30/}}

Products

Amkors designs, packages and tests semiconductors for other companies. The company's offers include RF-antenna designs incorporated directly into or onto a chip,{{cite web|access-date=2024-10-23 |date=2023-06-06 |title=FAQ: Antenna-in-package answers the “last mile” RF challenge, Part 2 |publisher=5gtechnologyworld.com |url=https://www.5gtechnologyworld.com/faq-antenna-in-package-answers-the-last-mile-rf-challenge-part-2/}} CMOS imaging sensors{{cite web|access-date=2024-10-23 |date=2002-11-05 |title=Amkor claims 13% of outsourced CMOS image sensor packaging |publisher=eetimes.com |url=https://www.eetimes.com/amkor-claims-13-of-outsourced-cmos-image-sensor-packaging/}} or flip chip packaging with copper pillars bumps.{{cite web|access-date=2024-10-23 |date= |title=Amkor Technology and Texas Instruments Deliver Industry’s First Fine Pitch Copper Pillar Flip Chip Packages to Market |publisher=techonline.com |url=https://www.techonline.com/products/amkor-technology-and-texas-instruments-deliver-industry-s-first-fine-pitch-copper-pillar-flip-chip-packages-to-market/}}{{cite web|access-date=2024-10-23 |date=2022-10-25 |title=Amkor looks to EU CHIPS Act for semiconductor packaging in Portugal |publisher=eenewseurope.com |url=https://www.eenewseurope.com/en/amkor-looks-to-eu-chips-act-for-semiconductor-packaging-in-portugal/}} Amkor also offers wire bonding of semiconductors to packages{{cite web|access-date=2024-10-23 |date=2023-10-19 |title=Wirebonding Is Here To Stay |publisher=semiengineering.com |url=https://semiengineering.com/wirebonding-is-here-to-stay/}} as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge Protection".{{cite web|access-date=2024-10-23 |date=2023-06-14 |title=Enhancing Punch MLF Packaging with Edge Protection Technology |publisher= semiengineering.com |url=https://semiengineering.com/enhancing-punch-mlf-packaging-with-edge-protection-technology/}}{{cite web|access-date=2024-10-23 |date= |title=Amkor's Edge Protection™ Technology |publisher=semiconductorpackagingnews.com |url=https://www.semiconductorpackagingnews.com/uploads/1/Amkor_s_Edge_Protection____Technology.pdf}}