LGA 3647
{{short description|Intel CPU socket for servers (released 2016)}}
{{Use mdy dates|date=October 2018}}
{{Infobox CPU socket
| name = LGA 3647
| image = 260px
| release-date = {{Start date|2016}}
| designed-by = Intel
| manufacturer = Lotes
| formfactors = Flip-chip
| contacts = 3647
| protocol = {{ubl |Intel UPI|DMI 3.0|PCI Express}}
| core bus =
| fsb =
| voltage =
| dimensions = 76.0mm × 56.5mm
4,294mm2
| processors = {{ubl ||Knights Landing |Knights Mill |Skylake-SP |Cascade Lake-SP |Cascade Lake-W}}
| predecessor = LGA 2011
| successor = LGA 4189
| memory = DDR4
|variant=LGA 2066 (HEDTs and workstations)}}
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"),{{Cite web |last=Alcorn |first=Paul |date=June 20, 2016 |title=Intel Xeon Phi Knights Landing Now Shipping; Omni Path Update, Too |url=http://www.tomshardware.com/news/intel-xeon-phi-knights-landing,32121.html |website=Tom's Hardware |language=en-US |access-date=November 14, 2022}} Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP, and Cascade Lake-W microprocessors.{{Cite web |last=Alcorn |first=Paul |date=June 3, 2016 |title=Skylake Xeon Platforms Spotted, Purley Makes A Quiet Splash At Computex |url=http://www.tomshardware.com/news/intel-xeon-skylake-purley-cpu,31980.html |website=Tom's Hardware |language=en-US |access-date=November 14, 2022}}
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for Quick Path Interconnect (QPI), and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place.
Variants
There are two sub-versions of this socket with differences also in the ILM (Independent Loading Mechanism, pitch of center screws changed slightly and a more visible one being that the guiding pins are in other corners). The processor socket and the matching notches on the processor are at different location, preventing insertion of an incompatible processor and preventing use of the wrong heatsink in a system. The more common P0 variant has two sub-options for heatsink mounting – designated as square ILM and narrow ILM, choice of which depends on the server and mainboard design (likely based on space constraints).
- LGA3647-0 (socket P0) used for Skylake-SP and Cascade Lake-SP processors{{Cite web |title=Intel® Xeon® Processor Scalable Family: Thermal Mechanical Specifications and Design Guide |url=https://www.intel.com/content/dam/www/public/us/en/documents/guides/xeon-scalable-thermal-guide.pdf |website=Intel |language=en-US |date=December 2019 |access-date=November 14, 2022}}
- LGA3647-1 (socket P1) used for Xeon Phi x200 processors{{Cite web |title=Intel® Xeon Phi™ Processor x200 Product Family Thermal/Mechanical Specification and Design Guide |url=https://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/xeon-phi-processor-x200-product-family-design-guide.pdf |website=Intel |language=en-US |date=June 2017 |access-date=November 14, 2022}}